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应用XPS和离子探针显微分析法,检测了在含有Cu~(2+),Sn~(2+)或Ni~(2+)电解液中,电解着色的铝氧化膜孔隙中沉积物的组成,考察了着色过程的电极行为以及膜阻抗的变化.结果表明,在电解着色过程中,AC负半周发生金属的沉积和H~+的还原,正半周发生氧化膜的活化和部分沉积金属的氧化,孔隙中的沉积物是金属及其氧化物的水溶胶,它导致膜的交流阻抗增大.由此,文中提出了电极交流阻抗等效电路,并求得各参数值.实验结果可较好地说明氧化膜阻扰与色调的关系,以及不同着色膜性能的差别.
XPS and ion-probe microanalyses were used to detect the deposition of the electroplated coloration in the pores of aluminum oxide films containing Cu 2+, Sn 2+ or Ni 2+ electrolytes The results show that during the process of electrolytic coloring, the deposition of metal and the reduction of H ~ + occur in the negative half cycle of AC, and the activation of oxide film and the partial deposition of metal Oxidation, the sediment in the pores is a hydrosol of the metal and its oxide, which leads to the increase of the AC impedance of the membrane. Thus, the equivalent circuit of the AC impedance of the electrode is proposed and the values of the parameters are obtained. Good description of oxide film interception and color relationship, as well as the different coloring film performance differences.