为了降低生产成本,国际半导体制造商以及封装测试代工企业纷纷将其封装产能转移至中国,从而直接拉动了中国半导体封装产业规模的迅速扩大。同时,中国芯片制造规模的不断扩大以及巨大且快速成长的终端电子应用市场也极大地推动了中国半导体封装产业的成长。两方面的影响,使得中国半导体封装业尽管受到金融危机的影响,但在全球半导体封装市场中的重要性却日益突出。 In order to reduce production costs, the international semiconductor manufacturers and packaging and testing foundries have moved their packaging capacity to China, which directly stimulated the rapid expansion of China’s semiconductor packaging industry. Meanwhile, the continuous expansion of China’s chip manufacturing scale and the huge and rapidly growing terminal electronic application market have greatly promoted the growth of China’s semiconductor packaging industry. The impact of both sides, making China’s semiconductor packaging industry despite the financial crisis, but the importance of the global semiconductor packaging market has become increasingly prominent.