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[会议论文] 作者：李坤锥,徐少华,唐宇闯,翁湘泽,王忆,
来源：第十二届中国国际半导体照明论坛 年份：2015
This paper focus our attention on the deep considerations for LED package technology.The research includes the following content: (i) the influence of binding force between the chip and substrate,the...
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