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[期刊论文] 作者：Shen Liangfeng,Fan Yeming,
来源：中国工程科学：英文版 年份：2010
许多研究证明了知识资源是革新的真正的来源和房地产企业的竞争力。因此，为实现知识管理(千米；公里) 建立房地产企业知识资源框架是基本工作，并且它应该被给足够的注意。一种房......
[期刊论文] 作者：Xiangxiang Fan,Yeming Gong,Xia,
来源：绿色包装 年份：2019
可回收运输物品(RTI)因其在减少包装垃圾和提高供应链可持续性方面的优势而被广泛使用。然而,RTI的损失将导致产品流与RTI 供应不匹配,从而影响运营的连续性。本文研究了一个...
[期刊论文] 作者：FAN Yeming,GUO Hong,XU Jun,CHU,
来源：稀有金属：英文版 年份：2011
钻石增强的铜(Cu/diamond ) composites 被一种压力渗入技术准备。composites 表演 713 W 的超级高传导性？...
Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging appl
[期刊论文] 作者：ZHANG Ximin,GUO Hong,YIN Fazhang,FAN Yeming,ZHANG Yongzhong,
来源：稀有金属（英文版） 年份：2011
Diamond/Cu-xCr composites were fabricated by pressure infiltration process. The thermal conductivifies of diamond/Cu-xCr (x = 0.1, 0.5,0.8) composites were abov...
Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diam
[期刊论文] 作者：HAN Yuanyuan,GUO Hong,YIN Fazhang,ZHANG Ximin,CHU Ke,FAN Yeming,
来源：稀有金属（英文版） 年份：2012
The thermal conductivity of diamond hybrid SiC/Cu,diamond/Cu and SiC/Cu composite were calculated by using the extended differential effective medium (DEM) theo...
[期刊论文] 作者：HAN Yuanyuan,GUO Hong,ZHANG Ximin,YIN Fazhang,CHU Ke,FAN Yeming,
来源：武汉理工大学学报（材料科学版）（英文版） 年份：2011
...
Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle si
[期刊论文] 作者：CHEN Chao,GUO Hong,CHU Ke,YIN Fazhang,ZHANG Ximing,HAN Yuanyuan,FAN Yeming,
来源：稀有金属（英文版） 年份：2011
The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied.The composites were prepared through pressure infiltrafion of liqu...
[期刊论文] 作者：FAN Yeming,GUO Hong,XU Jun,CHU Ke,ZHU Xuexin,JIA Chengchang,YIN Fazhang,ZHANG Ximin,
来源：稀有金属(英文版) 年份：2011
Diamond reinforced copper(Cu/diamond)composites were prepared by a pressure infiltration technique. The composites show a super high conductivity of 713 W·m-1...
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