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[期刊论文] 作者:WANG Jian-xin,XUE Song-bai,FANG Dian-song,JU Jin-long,HAN Zong-jie,YAO Li-hua, 来源:中国有色金属学会会刊(英文版) 年份:2006
Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively...
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