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Comparison of microstructures in electroformed and spin-formed copper liners of shaped charge underg
[期刊论文] 作者：FAN Ai-ling,LI Shu-kui,TIAN We,
来源：中国有色金属学会会刊（英文版） 年份：2004
The as-formed and post-deformed microstructures in both electroformed and spin-formed copper liners of shaped charge were studied by optical microscopy(OM), ele...
[期刊论文] 作者：SU Tie-jian,LI Shu-kui,WANG Fu-chi,
来源：北京理工大学学报（英文版） 年份：2005
TEM observation and analysis have been conducted on bainitic transformation with and without the influence of extally applied tensile stress for alloyed steel 3...
Effect of Annealing Process on Microstructure and Mechanical Properties of Ultrafine Copper Prepared
[期刊论文] 作者：ZHANG Zhao-hui,ZAHNG Chun,WANG Fu-chi,LI Shu-kui,
来源：北京理工大学学报（英文版） 年份：2010
The spark plasma sintering (SPS) method is used to prepare the ultrafine copper with the average grain size less than 10μm and the tensile strength greater tha...
Finite element analysis and experimental investigation of the hydrostatic extrusion process of defor
[期刊论文] 作者：ZHANG Zhao-hui,WANG Fu-chi,SUN Ming-yan,YANG Rui,LI Shu-kui,
来源：北京理工大学学报（英文版） 年份：2013
...
Numerical simulations of stress wave propagation and attenuation at arc-shaped interface inlayered S
[期刊论文] 作者：SUN Ming-yan,ZHANG Zhao-hui,YANG Rui,WANG Fu-chi,LI Shu-kui,
来源：北京理工大学学报（英文版） 年份：2013
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[期刊论文] 作者：NIAZI A R,LI Shu-kui,WANG Ying-chun,LIU Jin-xu,HU Zhi-yu,Usman,
来源：北京理工大学学报（英文版） 年份：2013
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[期刊论文] 作者：Li Yin,Hao Wu,Jian Gong,Jian-Hao Geng,Fan Jiang,An-Hui Shi,Rong Yu,Yong-Heng Li,Shu-Kui Han,Bo Xu,Guang-Ying,
来源：世界胃肠病学杂志（英文版） 年份：2012
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