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[期刊论文] 作者:Chenye Li,Zhensong Li,Min Miao, 来源:纳米技术与精密工程(英文) 年份:2020
With the continuous growth of signal frequency and package density, discontinuity of the high-frequency interconnection in 3 D micro/nano integration becomes un...
[期刊论文] 作者:Dai Jinghong,Huang Mei,Cao Min,Miao Liyun,Xiao Yonglong,Shi Yi,Meng Fanqing, 来源:中华医学杂志英文版 年份:2014
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