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[期刊论文] 作者：Dong-ling LI,Zheng-guo SHANG,Sheng-qiang WANG,Zhi-yu WEN,,
来源：Journal of Zhejiang University-Science C(Computers & Electro 年份：2013
Manufacturing and integration of micro-electro-mechanical systems(MEMS) devices and integrated circuits(ICs) by wafer bonding often generate problems caused by...
[会议论文] 作者：Yin-chuan Yang,Zh i-yu Wen,Xue-feng He,Dong-ling Li,Zheng-guo Shang,
来源：中国微米纳米技术学会第十届学术年会暨第一届国际会议(1st International Conference of th 年份：2008
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