Improvement of uniformity of cylindrical inductively coupled plasma with a direct current plate-to-g

来源 :13th Asia-Pacific Conference on Plasma Science and Technolog | 被引量 : 0次 | 上传用户:woNO111
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  Inductively Coupled Plasma is extensively applied to the plasma processing of various microelectronic devices manufacture such as semiconductor etching,thin film deposition and large-area wafer fabrication.In our experiment,uniformity of inductively coupled plasma (ICP) is improved with an additional self-design direct current (DC) plate-to-grid electrode.The plasma discharge parameters,such as plasma density and electron temperature,have been experimentally investigated with Langmuir double probe system.It is demonstrated that the DC power can obviously improve the uniformity of plasma density and decrease the electron temperature.
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