Packaging Inspection Using 3D Smart Sensors

来源 :2014机器视觉技术与工业应用研讨会 | 被引量 : 0次 | 上传用户:libra_li
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Overview What is LMI 3D Packaging Inspection Applications Challenges Solutions Who We Are A leading developer of 3D scanning technologies with the core competency of engineering at the chip level.We are passionate about solving complex 3D challenges in a simple way.Our mission is connecting customers to innovative 3D scanning solutions that enable them to achieve better business results.
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