In ELID (Electrolytic In process Dressing) grinding, the oxide film on grinding wheel plays an important role inimproving the quality of grinding surface for its assisting polishing function. The trib
In order to remove the cutting marks on the surface of the 6H-SiC cutting wafer, to investigate the mechanism ofthe abrasive grains in the lapping and optimize the component. Experiments were taken to
This article introduces the compound machining method of polycrystalline diamond(pcd), according to themachining characteristics of different components in polycrystalline organization, this machining
The growth of epitaxial layer of SiC wafer requires the surface of SiC substrate to reach an atomic scale accuracy.To solve the problems of low machining efficiency and low surface accuracy in the pol
This paper investigates the floating based abrasive polishing method for the inner and outer ring raceway of 6309type bearing through the improvement of experimental device. By testing the surface rou