Emergent Graphene For Interconnect Applications

来源 :2015台湾物理年会 | 被引量 : 0次 | 上传用户：devil521zhou

【摘要】

：

　　In this study,we propose and demonstrate electroplating of Cu on graphene seed layer.Graphene will be not only as the seed layer but also be the diffusion b

【作者】

：

C.S.Wu C.H.Liu Y.W.Su H.Y.Lin C.D.Chen

【机构】

：

Department of physics,National Chang-Hua University of Education,Chang Hua,Taiwan

【出处】

：

2015台湾物理年会

【发表日期】

：

2015年期

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　　In this study,we propose and demonstrate electroplating of Cu on graphene seed layer.Graphene will be not only as the seed layer but also be the diffusion barrier,which combines with copper electroplating.

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Emergent Graphene For Interconnect Applications

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