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Ni plasma enhanced atomic layer deposition(PE-ALD) using nickelocene[Ni(C5H5)2] as a precursor and NH3 plasma as a reactant was comparatively investigated.PE-ALD Ni using NH3 plasma showed low resistivity,and low C and N content.PE-ALD Ni films were analyzed by X-ray photoelectron spectroscopy(XPS), scanning electron microscopy(SEM), four point probe(FPP), ultraviolet photoelectron spectroscopy(UPS) and atomic-force microscopy (AFM).