【摘 要】
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Copper thin films were deposited on inner wall of rectangular carbon fibre reinforced plastic(CFRP) waveguide with high aspect ratio by plasma enhanced atomic layer deposition at low temperature, usin
【机 构】
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Science and Technology on Vacuum Technology and Physics Laboratory,Lanzhou Institute of Physics,Lanz
【出 处】
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2014国际高能束与特种能场制造暨第五届高能束流加工技术国际学术会议
论文部分内容阅读
Copper thin films were deposited on inner wall of rectangular carbon fibre reinforced plastic(CFRP) waveguide with high aspect ratio by plasma enhanced atomic layer deposition at low temperature, using copper amidinate and hydrogen as precursor and nitrogen as reductive gas.Influence of copper amidinate and hydrogen, temperature, power of plasma to deposition rate of copper thin film, purity of film and step coverage were studied.Morphology and composition of thin film were studied by atomic force microscope (AFM) and X-ray photoelectron spectroscopy(XPS), respectively.Square resistance of thin film was also tested by four probe technique.On the basis of on-line diagnosis, a growth mechanism of copper thin film was put forward, it was considered that surface functional group play an important role in the process of nucleation and determined property of thin film.High density of RF plasma and high content of free radical were helpful to the deposition of copper thin films.
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