The behaviors of endothelial cell and smooth muscle cell of different Ti-Cu films, and the properties of copper release and NO catalytic release from the films, as well as the possible mechanism of Ti-Cu films to catalytic release NO to promote endothelialization and inhibit the hyperplasia of smooth muscle cells were reported in this study. Ti-Cu films with different components and structures were fabricated on 316L SS and silicon wafers (100) via direct current magnetron sputtering (DCMS). Ti phase (10 at.%Cu ), amorphous (40 at.%Cu) and crystalline phase of Ti and Cu (40at.%Cu) of films are observed from the XRD and EDS results. The low corrosion current density of the all Ti–Cu films confirms improvement in corrosion resistance of the SS substrate. The Cu phase of films may facilitate the corrosion process compared to the films with Ti or amorphous phases. All the Ti-Cu samples exhibit high Cu ion release rates after 30 min immersion demonstrated by ICP-MS assay. The Cu ion release rates of all samples keep low but stable levels during the following immersion up to 30 days. The lower corrosion resistance of films containing Cu crystalline phase results in the higher Cu ion release rate. The results of catalytic release of nitrogen oxide (NO) show that all Ti-Cu samples have considerable NO generating catalytic activity compared to that of samples of Ti films, and have the stabilities of catalytic release NO for the time of 30 days. The results of morphology and vitality of smooth muscle cells in vitro show that the NO catalyzed by Ti-Cu films significantly inhibits the adhesion and proliferation of SMCs. In vitro EC cells culture tests demonstrated the NO catalyzed by films at a biological level could promote endothelialization and inhibit the hyperplasia of smooth muscle cells. This study presents a potential application for the modification of cardiovascular devices such as stents.