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In this paper.3-D transient and steady thermal models of an integrated GaN power module on the substrate of PCB (Printed Circuit Board) were built to study and solve severe heat concentration problems of GaN power devices with tiny size of 4.1*1.6 mm2.With the help of the steady thermal model, several factors influencing the junction-to-air thermal resistance (Rja) of the module were investigated detailedly.