一、前言 塑封工艺是半导体器件生产中极其重要的工艺手段之一。它具有产品质量稳定、生产批量大、成本低、效益高等特点,广泛应用于集成电路、半导体分立器件、电阻、电容等元件的封装。 塑封模是保证塑封工艺得以顺利实施的关键工艺装备之一。本文以集成电路塑封模为例,介绍塑封模的设计。 First, the foreword Plastic sealing process is one of the most important technological means in the production of semiconductor devices. It has a stable product quality, production volume, low cost, high efficiency, widely used in integrated circuits, semiconductor discrete devices, resistors, capacitors and other components of the package. Plastic mold is to ensure that the plastic packaging process to successfully implement one of the key technology and equipment. In this paper, an example of plastic mold for integrated circuits, plastic mold design.