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用金相显微镜和扫描电子显微镜分析了不同纯度的纯Mg经不同工艺挤压后的组织,并测试了其室温拉伸性能。结果表明:不同纯度的Mg在不同工艺挤压过程中均发生明显的动态再结晶,平均晶粒尺寸为20~25μm,同时能观察到变形孪晶。在相同挤压工艺条件下,纯度稍低的Mg的综合拉伸性能要优于纯度稍高的纯Mg。提高挤压比和降低挤压温度均能提高纯Mg的综合拉伸性能。纯度稍低的Mg经挤压比为60和挤压温度553 K挤压后的抗拉强度和伸长率分别能达到205 MPa和22.5%。
The microstructure of pure Mg with different purity after being extruded by different processes was analyzed by metallographic microscope and scanning electron microscope, and the tensile properties at room temperature were tested. The results show that Mg with different purities evidently undergo dynamic recrystallization during the extrusion process with the average grain size of 20-25 μm and the deformation twin can be observed. Under the same extrusion process conditions, the comprehensive tensile property of Mg with lower purity is better than pure Mg with slightly higher purity. Improve the extrusion ratio and reduce the extrusion temperature can improve the overall tensile properties of pure Mg. The tensile strength and elongation of Mg with slightly lower purity were 205 MPa and 22.5% respectively after being extruded at a compression ratio of 60 and a pressing temperature of 553 K.