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利用模拟空间热循环温度场设备对太阳能电池中石英玻璃盖片 /硅橡胶粘合剂 /硅晶片胶接结构进行了真空热循环试验 ( 12 3～ 4 0 3K ,10 -5Pa)。测试了热循环前后胶接试样的拉伸剪切性能、质损率和表面残余应力 ,观察了拉伸剪切断口形貌。结果表明 ,胶接试样室温拉伸剪切强度随热循环次数的增加而增强后下降 ,相应的断口破坏类型由混合型破坏转变为内聚破坏 ,最后为界面破坏 ,且胶接结构表面残余应力的变化为 :拉应力→零应力→压应力
The vacuum thermal cycle test (12 3 ~ 4 0 3 K, 10 -5 Pa) was performed on the quartz glass coversheet / silicone rubber adhesive / silicon wafer bonded structure in the solar cell by simulating thermal cycling temperature field equipment. Tensile shear properties, mass loss rate and surface residual stress of the bonded specimens before and after thermal cycling were tested. The appearance of tensile shear fracture was observed. The results show that the tensile shear strength at room temperature increases with the increase of thermal cycles, and then decreases. The corresponding fracture failure mode changes from mixed failure to cohesive failure, and finally to the failure of the interface, and the residual surface of the bonded structure The change of stress is: Tensile stress → zero stress → compressive stress