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随着引线数目的增多,双列直插式管壳的组装面积变大,而且散热也就越为困难。进而,自动插入也变得困难。因此,片状载体法和薄膜载体法被研制出来了。不过,片状载体法在自动化方面尚存在困难。笔者在此阐述了 IC 朝着大规模化高速度化方向发展,也考虑到自动化的场合,认为薄膜载体是有希望的。本文就现状的各种 IC 用的封装及商品动向简要地加以汇总。
As the number of leads increases, the assembly area of the dual in-line package becomes larger and heat dissipation becomes more difficult. Furthermore, automatic insertion becomes difficult. Therefore, the sheet carrier method and the film carrier method have been developed. However, there is still some difficulty in the automated method of sheet carrier method. Here I elaborate on the IC toward the direction of large-scale high-speed development, but also taking into account the occasion of automation, that the film carrier is promising. This article summarizes the current status of various IC packages and product trends.