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为解决大功率LED散热问题,构造了一种一体化并行多通道大功率LED回路热管散热器。利用水作为工质,在不同加热功率、不同倾斜角以及不同充液比条件下对该新结构热管散热器的热性能进行了研究。结果表明,这种新结构热管散热器不仅能使散热器上下底板处于均温状态,而且当芯片加热功率达到200 W时,芯片加热面中心最高温度不超过71.8℃;倾斜角度对热管换热性能影响不大;在一定加热功率范围内,新结构热管散热器的热阻随加热功率的增大而减小,当芯片加热功率达到240 W时,热阻最小,最小可达0.19K/W。构造的一体化并行多通道大功率LED回路热管散热器具有很好的传热性能,并提高了承载高热流密度的能力。
In order to solve the heat dissipation problem of high power LED, an integrated parallel multi-channel high-power LED heat pipe heat sink is constructed. Using water as the working fluid, the thermal performance of the new heat pipe radiator was studied under different heating powers, different tilt angles and different filling ratio. The results show that the new structure of the heat pipe radiator can not only make the upper and lower bottom plate of the radiator keep the average temperature, but also the maximum temperature of the center of the heating surface of the chip does not exceed 71.8 ℃ when the chip heating power reaches 200 W; The thermal resistance of the new structure heat pipe radiator decreases with the increase of heating power within a certain heating power range. When the heating power of the chip reaches 240 W, the thermal resistance is the smallest, and the minimum is 0.19K / W. Constructed integrated parallel multi-channel high-power LED loop heat pipe heat sink has good heat transfer performance, and increased the ability to carry high heat flux density.