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Based on the high frequency techniques such as frequency response measurement,equivalent circuit modeling and packaging parasitics compensation,a comprehensive optimization method for packaging high-speed semiconductor laser module is presented in this paper.The experiments show that the small-signal magnitude frequency response of the TO packaged laser module is superior to that of laser diode in frequencies,and the in-band flatness and the phase-frequency linearity are also improved significantly.
Based on the high frequency technique such as frequency response measurement, equivalent circuit modeling and packaging parasitics compensation, a comprehensive optimization method for packaging high-speed semiconductor laser module is presented in this paper. The experiments show that the small-signal magnitude frequency response of the TO packaged laser module is superior to that of laser diode in frequencies, and the in-band flatness and the phase-frequency linearity are also improved significantly.