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研究了SnBi和SnBi+石墨复合钎料的电迁移性能,发现在SnBi复合钎料中添加石墨增强颗粒,导致该复合钎料的润湿性能降低,并且随着石墨含量的增加,其铺展系数越来越低。SnBi钎料在5A电流冲击下,晶粒首先在焦耳热的作用下粗化,随后在“电子风”的冲击下逐渐细化,从而硬度表现出先下降后上升的趋势。SnBi钎料在10A电流冲击下,由于电流较大,晶粒在“电子风”的冲击下逐渐细化,从而硬度表现出上升趋势。SnBi+石墨复合钎料在5和10A电流的作用下组织和力学性能变化均不明显,主要是由于石墨的加入提高了复合钎料的抗电迁移性能。
The electromigration properties of SnBi and SnBi + graphite composite brazing filler metals were investigated. It was found that adding graphite reinforcing particles into SnBi composite brazing filler metal resulted in the decrease of wettability of the composite brazing filler metal. With the increase of graphite content, the spreading coefficient was more and more Lower. SnBi brazing material under 5A current impact, the first coarse grains in the role of Joule heat, followed by the “electronic wind” under the gradual refinement of the hardness showed a downward trend first and then increased. Under the impact of 10A current, the SnBi brazing filler metal gradually thinned under the impact of “Electronic Wind” due to the large current, so the hardness showed an upward trend. The change of microstructure and mechanical properties of SnBi + graphite composite brazing filler metal under the current of 5 and 10A are not obvious, which is mainly caused by the addition of graphite to improve the electromigration resistance of the composite brazing filler metal.