对典型硅基梳齿式MEMS器件进行失效调查和分析,验证其主要失效模式,分析其失效机理。利用电子扫描显微镜(SEM)、X射线透视系统、扫描声学显微镜(SAM)、X射线能谱成份分析(EDX)、金相切片分析、封装气体分析及电性能测试等分析技术,发现在工艺制造中的机械失效是造成此类器件失效的主要原因。另外,此类器件的封装失效主要表现为气密性失效和装配工艺失效。 Failure investigation and analysis of a typical silicon-based comb-tooth MEMS device were conducted to verify its main failure mode and analyze its failure mechanism. The results of SEM, X-ray fluoroscopy, scanning acoustic microscopy (SAM), energy dispersive X-ray spectrometry (EDX), metallographic slice analysis, Mechanical failure in these devices is the main reason for failure. In addition, the package failure of such devices mainly manifested as air-tight failure and assembly process failure.