1 前言 随着PCB制作精度的提高,曾经在L/S较大的板面仅被视为轻微的线路不规则,现在在精细线路制作中已变为导致良率下降的功能性缺陷。本文以蚀刻法为题,实际涵盖内层板和采用蚀刻制程的外层板制作。在采用蚀刻方式制作的各种阻抗板和带有埋 1 INTRODUCTION With the improvement of PCB fabrication accuracy, once the board with large L / S has only been regarded as a minor line irregularity and has now become a functional defect that leads to yield degradation in the production of fine lines. In this paper, the title of etching method, the actual cover of the inner plate and the use of etching process of the outer plate production. In the use of etching methods for the production of a variety of impedance plates and with buried