面对不断缩短产品上市时间和提高赢利能力的双重压力,许多半导体制造商都把外包做为2003年的重要业务战略。继晶圆生产外包之后,现在,无晶圆厂(Fabless)商和集成器件制造商(IDM)也已开始将测试和组装业务外包出去。外包的趋势对半导体封装、组装和测试行业有重大的影响。在过去 Faced with the dual pressures of continuously reducing time-to-market and profitability, many semiconductor manufacturers have outsourced their outsourcing efforts in 2003 as an important business strategy. Following the outsourcing of wafer production, fabless vendors and integrated device manufacturers (IDMs) have now begun outsourcing their test and assembly operations. The trend of outsourcing has a significant impact on the semiconductor packaging, assembly and testing industries. In the past