Preparation of Material Surface Structure Similar to Hydrophobic Structure of Lotus Leaf

来源 :武汉理工大学学报(材料科学版)(英文版) | 被引量 : 0次 | 上传用户:kaifeng_chen
下载到本地 , 更方便阅读
声明 : 本文档内容版权归属内容提供方 , 如果您对本文有版权争议 , 可与客服联系进行内容授权或下架
论文部分内容阅读
Nano/micro replication,a technique widely applied in the microelectronics field,was introduced to prepare the hydrophobic bionics microstructure on material surface.Poly(vinyl alcohol)(PVA)and polystyrene(PS)moulds of the mastoid microstructure on lotus leaf surface were prepared respectively by the nano/micro replication technology.And poly(dimethylsiloxane)(PDMS)replicas with the mastoid-like microstructure were prepared from these two kinds of polymer moulds.Scanning electronic microscope(SEM) was employed to investigate the morphology and microstructures on moulds and replicas.Both the static and dynamic contact angles between water droplet and PDMS replicas’surface were also measured.As a result,similar microstructure Can be observed clearly on the surface of PDMS replicas and the static contact angle on PDMS replicas was enhanced dramatically by the existence of these microstructures.
其他文献
The design method of small-flow high-head centrifugal-vortex pump was presented.This pump,configured with 1nducer,complex-centrifulgal impeller and open-vortex
生物工程则是生物技术的统称,是指运用生物化学、分子生物学、微生物学.遗传学等原理与生化工程相结合,来改造或重新创造设计细胞的遗传物质、培育出新品种,以工业规模利用现
“用工荒”的背后不仅是经济问题、产业结构问题,它的本质是一个社会问题。务工者的生存状态的改善,不仅仅是来自工资待遇的提升,还来自更多的被尊重被肯定被爱护的归属感。
先进入莽莽原始森林的大山,再乘船在一望无垠的碧波上乘风前进,或许这是体验马来西亚风光的最佳旅行方式之一。
为探究吕家坨井田地质构造格局,根据钻孔勘探资料,采用分形理论和趋势面分析方法,研究了井田7
转鼓鞣制过程需要消耗大量的水和化学试剂,它们大多最终成为废水。本文探讨了一种可以在工业化条件下的替代传统浸酸铬鞣法的鞣革新方法。新方法用芳磺酸代替甲酸和硫酸,由于
A new mesoporous carbon-tin (MC-Sn) nanocomposite has been successfully prepared via a two-step method. From the transmission electron microscopy (TEM) observat
The effect of Ti-Al on microstructures and mechanical properties of SiCp/Al MMC joints produced by plasma arc in-situ weld-alloying was investigated, in which a
针对防雷工程在设计阶段的特点,运用风险管理的原理和系统方法,提出对设计阶段风险问题的辨识、量化、防范和控制,力求为业主和防雷工程承包商提出在EPC模式中的设计管理阶段作
Soldering experiments of quad flat package(QFP) devices were carried out by means of diode laser soldering system with Sn-Ag-Cu and Sn-Cu-Ni lead-free solders,