理光公司最近研制出了微型气体传感器。它采用该公司独有的薄膜成型法—等离子蒸发技术和硅细加工技术,把气体检测部分做在硅片上,便之工芯片化。芯片大小为1.5mm×1.5mm,一个芯片上有4个气体检测部分。气体检测所采用的氧化锡在工作时必须加热到400℃左右,由于该传感器薄膜化,因而只需0.01s就可达到所需温度。所需的时间和消耗的功率都减少了,只有以前产品的三十分之一到五十分之一。气体检测的原理和以往 Ricoh has recently developed a miniature gas sensor. It uses the company’s unique thin film forming method - plasma evaporation technology and silicon fine processing technology, the gas detection part of the silicon wafer, then the work of the chip. Chip size 1.5mm × 1.5mm, a chip has four gas detection section. The tin oxide used for gas detection must be heated to about 400 ° C at work. Since the sensor is thin, it takes only 0.01 s to reach the desired temperature. The time required and the power consumed are reduced, from one thirtieth to one fiftieth of the previous products. The principle of gas detection and in the past