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对无铅焊料的发展、种类、物理和力学性能进行了综述分析,评价了目前常用的几种无铅焊料系列在电子产品封装使用中的优缺点,出现问题的一些解决办法,适用的焊接工艺。指出了当前无铅焊料急需解决的关键问题和未来无铅焊料的发展趋势。
The development, types, physical and mechanical properties of lead-free solders are reviewed and analyzed. The advantages and disadvantages of several commonly used lead-free solders in the packaging of electronic products are evaluated. Some solutions to the problems and the applicable welding processes . The key issues urgently needed to be solved by the current lead-free solders and the development trend of the future lead-free solders are pointed out.