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以双酚A型环氧树脂(E-51)为基体,C/SiO2复合微纳米粒为增强体,在机械剪切搅拌和超声波震荡下充分分散后浇铸成型,制备C/SiO2/E-51复合材料。对复合材料差热分析,红外、扫描电镜、机械性能等测试表明:当填充2%C/SiO2复合微纳米粒时,复合材料的玻璃化转变温度、拉伸强度、拉伸弹性模量、断裂伸长率、冲击强度分别达到147℃、64.8MPa、6913MPa、7.66%、12.5MPa,较纯环氧体系有较大的提高。这可能一方面由于SiO2中的Si-O-键在硅烷偶联剂(KH570)的作用下与E-51的环氧基形成高能的共价键,且有较强的界面张力,另一方面,C粒子进入交联环氧树脂的空隙中,起到了应力传递和增强作用。
Using bisphenol A type epoxy resin (E-51) as matrix and C / SiO2 composite micro-nano-particles as reinforcements, C / SiO2 / E-51 was prepared by fully dispersion after mechanical shearing and ultrasonic vibration Composites. The results of differential thermal analysis, infrared, scanning electron microscopy and mechanical properties of the composites show that the glass transition temperature, tensile strength, tensile modulus and fracture of the composite when filled with 2% C / SiO2 composite micro- Elongation and impact strength reached 147 ℃, 64.8MPa, 6913MPa, 7.66% and 12.5MPa respectively, which were higher than the pure epoxy system. This may be due on the one hand to the Si-O-Si bonds in SiO 2 with silane coupling agent (KH570) forming a high-energy covalent bond with the epoxy group of E-51 and having a strong interfacial tension. On the other hand , C particles into the voids of the crosslinked epoxy resin, played a stress transfer and enhance the role.