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采用不同的镀铝温度在20碳钢上制备了不同厚度的热浸镀铝层,通过测量热浸镀铝层厚度以及高温氧化后渗铝层/基体界面空洞平均直径和形核数量随氧化时间的变化,研究了镀铝温度对渗铝层/基体界面空洞生长的影响。结果表明:随镀铝温度升高,镀铝后的表面层厚度减小,合金层厚度增加;在高温氧化期间,渗铝层/基体界面空洞的生长速度随镀铝温度的升高而减小,其变化规律与热浸镀铝后表面层厚度随镀铝温度的变化规律相一致;界面空洞平均深度随镀铝温度升高而增加,其变化规律与热浸镀铝后合金层厚度随镀铝温度的变化规律相一致;界面空洞增量随氧化时间的延长先增加而后逐步减少,且镀铝温度越高,空洞形核速度越小。分析了镀铝温度对界面空洞生长的影响机制。
Different thicknesses of hot-dip aluminizing layers were prepared on 20 carbon steel by different aluminizing temperatures. By measuring the thickness of the hot-dip aluminizing layers and the average diameter of the cavities and the number of nucleation at the aluminized layer / matrix interface after oxidation at high temperature, The effects of aluminizing temperature on the cavities growth at the aluminized layer / matrix interface were investigated. The results show that with the increase of temperature, the thickness of the surface layer decreases and the thickness of the alloy layer increases. During the high temperature oxidation, the growth rate of the cavities in the aluminized layer / matrix interface decreases with the increase of the aluminum temperature , And its variation is consistent with the variation of the surface layer thickness after hot-dip aluminizing with the variation of the aluminizing temperature. The average depth of the interface cavities increases with the increasing of the aluminizing temperature. The variation and the thickness of the alloy layer after hot- The change of aluminum temperature is consistent. The void increment of interface increases first and then decreases gradually with the prolongation of oxidation time. The higher the temperature of aluminum deposition, the smaller the velocity of hollow nucleation. The mechanism of the influence of the temperature of aluminum plating on the growth of interface voids was analyzed.