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焊膏在电路元件和微型集成电路的贴装技术 (SMT)中是关键材料 ,焊膏的印刷性、粘度、粉末氧化、塌边 (坍塌 )性及搅溶性都取决于焊粉的性质。作者概述了五种焊粉的制造方法 (机械合金化法、气体喷雾法、离心喷雾法、振动喷雾法和旋转喷雾法 )及其特征 ,焊粉的成分和性质 ,粉末形状对焊膏性能的影响 ,焊粉的分级方法。并对气体喷雾法和离心法进行了比较。今后焊粉制造技术将向离心喷雾装置与高效分级装置相结合的方向发展。目标是以低的生产成本 ,制造氧化程度小 ,粒度分布范围窄及真圆球状的焊粉。
Solder paste is the key material in SMT and SMT components. The solder paste’s printability, viscosity, powder oxidation, slump (collapse), and solubility depend on the nature of the solder powder. The author summarizes the five solder powder manufacturing methods (mechanical alloying, gas spraying, centrifugal spraying, vibration spraying and rotary spraying) and their characteristics, the composition and properties of the solder powder, the shape of the solder powder paste Impact, classification of solder powder method. The gas spray method and the centrifugal method were compared. In the future solder powder manufacturing technology will be centrifugal spray device and efficient grading device combination of the direction. The goal is to produce solder with a low degree of oxidation, a narrow particle size distribution and a true spherical shape with low production costs.