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采用化学镀方法在聚酰亚胺纤维表面进行镀铜,实现聚酰亚胺纤维表面金属化。通过场发射扫描电子显微镜、能谱仪、微电子测试仪等测试手段对所制备的样品进行表征。讨论了工艺条件对镀铜纤维镀层厚度和表面电阻的影响,确定了最佳的施镀时间和温度,并对镀层的形貌、成分、结合强度和导电性能进行了分析。实验结果表明,在时间为10min,温度为33℃条件下化学镀铜处理后,聚酰亚胺纤维表面的镀层覆盖均匀、致密,晶粒细致,厚度约为0.75μm,与纤维结合力好,导电性能优越。
The electroless plating method is used for copper plating on the surface of the polyimide fiber to realize the metallization of the polyimide fiber surface. The prepared samples were characterized by field emission scanning electron microscopy, energy dispersive spectroscopy, microelectronic testers and other testing methods. The effects of process conditions on the thickness and surface resistance of copper plated fibers were discussed. The optimum plating time and temperature were determined. The morphology, composition, bonding strength and electrical conductivity of the coatings were also analyzed. The experimental results show that the coating on the surface of the polyimide fiber is uniform, dense and fine grain with the thickness of about 0.75μm after the electroless copper plating treatment at a temperature of 33 ℃ for 10min and the bonding strength with the fiber is good, Excellent conductivity.