最近电子机器、特别像体型VTR、摄像机,携带式电话机等急速向小型化、高功能化方向发展,用于这些领域的多层板,为了减少层数实现高密度布线,在图形细密化的同时,特要求盲孔小径化,而用以前的制造技术是难以作到的。 以此为目的开发了用光加工微小径盲 In recent years, electronic devices, especially VTRs, camcorders and portable telephones, have been rapidly developed in the direction of miniaturization and high functionality. Multilayer boards used in these fields have been densified in order to reduce the number of layers, At the same time, special requirements blind hole blind, but with the previous manufacturing technology is difficult to achieve. For this purpose, the development of the use of light processing blind small blind