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Ti3SiC2 has the potential to replace graphite as reinforcing particles in Cu matrix composites for applications in brush,electrical contacts and electrode materials.In this paper the fabrication of Cu-Ti3SiC2 metal matrix composites prepared by warm compaction powder metallurgy forming and spark plasma sintering(SPS) was studied.The stability of Ti3SiC2 at different sintering temperatures was also studied.The present experimental results indicate that the reinforcing particles in Cu-Ti3SiC2 composites are not stable at and above 800℃.The decomposition of Ti3SiC2 will lead to the formation of TiC and/or other carbides and TiSi2.If purity is the major concern,the processing and servicing temperatures of the Cu-Ti3SiC2 composite should be limited to 750℃ or lower.The composites prepared by warm compaction forming and SPS sintering at 750℃ have lower density when compared with the composites prepared by SPS sintering at 950℃,but their electrical resistivity values are very close to each other and even lower.
Ti3SiC2 has the potential to replace graphite as reinforcing particles in Cu matrix composites for applications in brush, electrical contacts and electrode materials. This paper the fabrication of Cu-Ti3SiC2 metal matrix composites prepared by warm compaction powder metallurgy forming and spark plasma sintering (SPS ) was studied. stability of Ti3SiC2 at different sintering temperatures was also studied. The present experimental results indicate that the reinforcing particles in Cu-Ti3SiC2 composites are not stable at and above 800 ° C. The decomposition of Ti3SiC2 will lead to the formation of TiC and / or other carbides and TiSi2.If purity is the major concern, the processing and servicing temperatures of the Cu-Ti3SiC2 composite should be limited to 750 ° C or lower. The composites prepared by warm compaction forming and SPS sintering at 750 ° C have lower density when compared with the composites prepared by SPS sintering at 950 ℃, but their electrical resistivity values are very close to each other and even lower.