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对两种不同基板压印接头进行局部热处理,研究局部热处理对不同基板压印接头拉伸力学性能的影响。结果表明:局部热处理能够提高接头强度、增大接头拉伸位移及能量吸收值。局部热处理使基板强度增大,接头内锁部分在从基板拉出时阻力变大,导致内锁部分被撕裂的程度加大,也正是这个原因使得压印接头的综合力学性能得到提升。
The effects of local heat treatment on tensile mechanical properties of different substrate embossed joints were investigated by local heat treatment of two different substrate imprinted joints. The results show that the local heat treatment can improve the joint strength and increase the tension displacement and energy absorption value. Local heat treatment increases the strength of the substrate, resulting in increased resistance of the inner locking portion of the connector as it is pulled out of the substrate, resulting in a greater degree of tearing of the inner locking portion. It is also for this reason that the overall mechanical properties of the stamped connector are improved.