一、引言半导体硅器件,特别是大、中规模集成电路,除要求硅片具有一定的电学性能,还要求晶体完整、表面禾损伤、具有一定的机械强度。硅片的强度不仅与单晶生长条件及热处理有关,还明显地受硅片表面状况的影 First, the introduction of semiconductor silicon devices, especially large and medium-scale integrated circuits, in addition to the silicon requires a certain electrical properties, but also requires the integrity of the crystal, surface Wo injury, with a certain degree of mechanical strength. The strength of the silicon is not only related to the single crystal growth conditions and heat treatment, but also obviously affected by the surface condition of the silicon