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众所周知,电镀溶液的PH值是工艺控制过程的主要参数之一,它直接影响阴极上氢离子的放电电位和阳极金属的溶解电位,PH过低大量氢气在阴极析出,PH太高造成金属氢氧化物沉淀夹入镀层,降低镀层物理性能.PH值的改变还会改变络合物的平衡以及添加剂在电极表面吸附程度.就宏观来说,电解液的PH值是容易测定的,只要根据不同的PH范围选择适当的参考电极便可准确测定,但在电极反应过程中,测定电极表面附近微区内PH的变化与金属离子氧化还原电位数值,只能靠特殊要求的微电极,配合适当设备来测定. 我们研究的电解液是弱酸性的,因此选择了锑电极作指示电极,即:锑/氧化
It is well-known that the pH value of electroplating solution is one of the main parameters in the process of process control. It directly affects the discharge potential of hydrogen ions on the cathode and the dissolution potential of the anode metal. The PH is too low and a large amount of hydrogen is precipitated at the cathode. PH value of the change will change the balance of the complex and the degree of adsorption of the additive on the electrode surface.On macro, the electrolyte PH value is easy to determine, as long as the different according to the PH range of the appropriate choice of reference electrode can be accurately measured, but in the electrode reaction process, the determination of the PH near the electrode surface changes in the area and the metal ion redox potential values, only by special requirements of the microelectrode, with the appropriate equipment to The electrolyte we studied was weakly acidic, so an antimony electrode was chosen as the indicator electrode, namely: antimony / oxidation