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对TA2/316L焊接接头分别进行350～900℃、保温30～120 min的真空热处理,利用SEM、EDX及热力学、动力学等分析手段研究了热处理后界面反应物的生长过程及规律。结果表明,界面反应物呈层状出现,且随着热处理温度的升高,层状反应物由一层变为多层。动力学计算显示,在900℃以下对TA2/316L接头进行热处理,其界面金属间化合物呈线性增长,界面总金属间化合物生长动力学方程可表示为W=1.15×106exp(-50.93kJ.mol-1/(RT)1t2。
The TA2 / 316L welded joints were subjected to vacuum heat treatment at 350-900 ℃ for 30-120 min respectively. The growth process and regularity of interface reactants after heat treatment were studied by means of SEM, EDX and thermodynamics and kinetics. The results showed that the interfacial reactants appeared in the form of layers, and the layered reactants changed from one layer to multiple layers with the increase of the heat treatment temperature. The kinetic calculations show that the heat treatment of TA2 / 316L joints below 900 ℃ increases the intermetallic compound linearly, and the growth kinetics equation of intermetallic compound can be expressed as W = 1.15 × 106exp (-50.93kJ.mol- 1 / (RT) 1t2.