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在当前集成电路加工工艺的最新研究中,激光加工是一项引人注目的新技术。发展集成电路工艺的目标是在较低的工作溫度下得到较浅的结深度和较高的工作速度,並增加其组装密度以实现三维集成。用激光来进行加工是达到这些目标的关键所在,目前美、日、德及世界各国都在开展这方面的研究。可以预言:由于激光加工所引起的设计革命和装备革新将会对大规模集成电路技术产生重大影响. 目前激光加工已在以下几个方面开展研究:
In the latest research on integrated circuit fabrication processes, laser machining is a compelling new technology. The goal of developing integrated circuit processes is to achieve shallower junction depths and higher operating speeds at lower operating temperatures and to increase their assembly density for three-dimensional integration. Laser processing is the key to achieve these goals, at present, the United States, Japan, Germany and the rest of the world are carrying out research in this area. Can predict: due to laser processing caused by the design revolution and equipment innovation will have a significant impact on large-scale integrated circuit technology.At present, laser processing has been carried out in the following areas: