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以Ti粉、B粉和Cu粉为原材料,球磨后,采用热压法原位合成Cu-15%TiB_2(质量分数)复合材料。并详细讨论了Cu-Ti-B体系的反应过程。通过XRD、SEM、EDS、XPS等手段,确定了Ti和B在Cu基体中原位合成了TiB_2,并利用XRD制作TiB_2和Cu的定标曲线,采用外标法计算出不同烧结温度下TiB_2的合成率。结果表明,在一定的温度范围内,温度越高,合成率越高,在1000℃时TiB_2的合成率可达99.27%。并测试Cu-1.5%TiB_2块状试样的维氏硬度,电导率和三点弯曲强度,分别为125.68 MPa、80.1%IACS和755.2 MPa,在100℃时的热膨胀系数和导热系数分别为9.3×10~(-6) K~(-1)和260 W/(m·K)。
Ti powder, B powder and Cu powder were used as raw materials. After ball milling, Cu-15% TiB_2 (mass fraction) composites were synthesized by hot pressing in situ. The reaction process of Cu-Ti-B system was discussed in detail. TiB_2 was synthesized in-situ from Ti and B by XRD, SEM, EDS and XPS, and the calibration curve of TiB_2 and Cu was made by XRD. The external standard method was used to calculate the synthesis of TiB_2 at different sintering temperatures rate. The results show that the higher the temperature is, the higher the synthesis rate is at a certain temperature range. The synthesis rate of TiB_2 can reach 99.27% at 1000 ℃. The Vickers hardness, electrical conductivity and three-point bending strength of Cu-1.5% TiB 2 bulk samples were tested and found to be 125.68 MPa, 80.1% IACS and 755.2 MPa, respectively. The coefficients of thermal expansion and thermal conductivity at 100 ℃ were 9.3 × 10 ~ (-6) K ~ (-1) and 260 W / (m · K).