在半导体工艺中,采用等离子技术(除胶)已经十年了。十年来,在保持环境清洁,提高工艺合理性,和节省原料等方面取得了一定的效果。这就是众所周知的,利用由电子、正负离子、各种能级的激励分子、自由原子团、光子等组成的所谓等离子干式剥离 In the semiconductor process, the use of plasma technology (except plastic) has been for ten years. In the past ten years, we have made some achievements in keeping the environment clean, improving the process rationality, and saving raw materials. This is well-known, using so-called plasma dry stripping consisting of electrons, positive and negative ions, excitons of various energy levels, free radicals, photons and the like