估计到1990年,世界上销售的元件有一半以上是供表面组装的,为此,各国都在大力进行元件、封装和新的制造工艺方面的研究和探索。一些关键问题,诸如变量元件和接插件的焊接和安装问题,用新的材料和包装解决半导体器件插脚增加和热量集中的问题,用新材料和改进敷层设计解决印制板与表面组装有关的机械和散热问题等等,都将会有新的突破。 It is estimated that in 1990, more than half of the components sold in the world are for surface assembly. Therefore, various countries are vigorously studying and exploring components, packaging and new manufacturing processes. Some of the key issues, such as soldering and mounting problems with variable components and connectors, addressing the problem of increased pinning and heat sinking of semiconductor devices with new materials and packaging, new materials and improved layup solutions to solve the problem of PCB assembly with surface assembly Mechanical and thermal issues, etc., there will be a new breakthrough.