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介绍了红外成像信号检测技术的发展及现状、二维混合红外焦平面阵列 (IR FPAs)的基本概念和单元结构 ,并结合 BDI和 CTIA两种读取电路对红外成像信号检测技术的工作原理进行了阐述。
This paper introduces the development and current status of infrared imaging signal detection technology, the basic concepts and cell structure of two-dimensional hybrid infrared focal plane array (IRFPAs), and combines the readout circuit of BDI and CTIA to the working principle of infrared imaging signal detection technology Expounded.