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倒装焊器件与常规的引线键合结构不同,现行的DPA标准不能完全适用于倒装焊结构。结合现有标准和倒装焊器件结构特点,以某塑封倒装焊集成电路器件为例,提出一套经过试验验证的、实用性强的倒装焊器件DPA试验流程。在原来标准的基础上提出了对BGA焊球材料成分分析、底充胶检查的超声扫描要求、芯片凸点结构检查等一些新的DPA要求。BGA焊球材料成分分析是使用能谱分析实现的,而芯片凸点结构检查则是通过对器件进行研磨开封实现的。经过试验验证,该流程方案可用于倒装焊集成电路器件的实际DPA工作。
Flip-chip devices and conventional lead wire bonding structure is different, the current DPA standard can not be fully applied to flip-chip structure. Combined with the existing standard and flip-chip device structural features, taking a plastic flip-chip integrated circuit device as an example, a set of tested and practical DPA test flow of flip-chip device is proposed. On the basis of the original standard, some new DPA requirements, such as component analysis of BGA solder ball material, ultrasonic scanning requirements of underfill inspection, inspection of chip bump structure, etc., are proposed. BGA solder ball material composition analysis using energy spectrum analysis to achieve, and the chip bump structure inspection is carried out by grinding the device Kaifeng achieved. After verification, this flow scheme can be used for the actual DPA operation of flip-chip integrated circuit devices.