论文部分内容阅读
用热-力学模拟试验机Gleeble 1500D进行O相合金Ti-22Al-25Nb的固态扩散连接。结果表明:当连接温度和连接压强分别不低于970℃和7 MPa以及保温时间不短于30 min时,能获得界面结合致密的接头;当连接温度高于1 000℃时,B2基体相明显粗化,且O相明显减少;当连接温度、压强和保温时间分别为1 020℃、7 MPa和30 min时,接头室温和650℃的拉伸强度分别为925 MPa和654 MPa;当连接温度不高于1 000℃的接头,拉伸断裂大部分发生在结合界面;当连接温度高于1 000℃时,则断裂主要发生在近界面母材中。
The solid-state diffusion bonding of the O-phase alloy Ti-22Al-25Nb was performed using a thermal-mechanical simulator Gleeble 1500D. The results show that when the connection temperature and connection pressure are not less than 970 ℃ and 7 MPa, respectively, and the holding time is not less than 30 min, a dense interface can be obtained. When the connection temperature is higher than 1 000 ℃, the B2 matrix is obviously Roughening and O phase obviously decrease. When the temperature, pressure and holding time are 1 020 ℃, 7 MPa and 30 min respectively, the tensile strength at room temperature and 650 ℃ are 925 MPa and 654 MPa, respectively. When the connection temperature The tensile fracture occurred mostly in the bond interface when the bond temperature was not higher than 1 000 ℃. When the bond temperature was higher than 1000 ℃, the fracture occurred mainly in the near-interface base metal.