芯片级(CSP)或其他种类的高密度封装技术在Nepcon West成为热点,该展会于2月21日至25日在美国加利福尼亚州Anaheim市的anaheim会议中心举行。许多今年的技术论文和展品都聚焦于如何将高密度封装器件组装到印刷电路板上。 人们已经意识到,象芯片级封装这样的技术再也不是什么新鲜事了,而且封装领域不可分割的一部分,这在展示各种组装技术的技术进步中心 Chip-level (CSP) or other types of high-density packaging technology became a hot spot at Nepcon West, which took place at the Anaheim Convention Center in Anaheim, California, USA from February 21 to February 25. Many of this year’s technical papers and exhibits focus on how to package high-density packages on printed circuit boards. People have come to realize that technology like chip scale packaging is nothing new, and an integral part of the packaging arena, which is where the technological advances that demonstrate various assembly technologies