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A layout-pattern-dependent electroplating model is developed based on the physical mechanism of the electroplating process.Our proposed electroplating model has an advantage over former ones due to a consideration of the variation of copper deposition rate with different layout parameters during the process.The simulation results compared with silicon data demonstrate the improvement in accuracy.
A layout-pattern-dependent electroplating model is developed based on the physical mechanism of the electroplating process. Our proposed electroplating model has an advantage over former ones due to a consideration of the variation of copper deposition rate with different layout parameters during the process. simulation results compared with silicon data demonstrates the improvement in accuracy.