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基于新型的刚性非共平面二胺4’,4″-(2,2-diphenylethene-1,1-diyl)dibiphenyl-4-amine(TPEDA)环氧树脂固化剂,采用动态机械分析(DMA)、热机械分析(TMA)和阻抗分析全面研究了其固化环氧树脂(E51)所制备的环氧固化物(E51/TPEDA)的热、机械和介电等综合性能.并与商业化的固化剂2,4-二氨基二苯甲烷(DDM)、4,4二氨基二苯砜(DDS)固化环氧树脂体系进行对比,结果表明由于TPEDA特有的刚性非共平面结构的引入,E51/TPEDA体系表现了较高的玻璃化转变温度、拉伸强度和较低的热膨胀系数、介电常数与损耗等优异物理性能.因此,基于新型非共平面二胺的环氧树脂固化物表现了在电子封装领域的潜在应用前景.
Based on the novel rigid non-coplanar diamine 4 ’, 4 "- 2,2-diphenylethene-1,1-diyl dibiphenyl-4-amine (TPEDA) epoxy resin curing agent, Thermomechanical Analysis (TMA) and Impedance Analysis The comprehensive properties of the cured epoxy resin (E51) epoxy cured material (E51 / TPEDA) were investigated in terms of thermal, mechanical and dielectric properties, and compared with the commercial curing agent 2,4-diaminodiphenylmethane (DDM) and 4,4-diaminodiphenyl sulfone (DDS) cured epoxy resin system. The results show that due to the introduction of rigid non-coplanar structure unique to TPEDA, the E51 / TPEDA system Exhibits superior physical properties such as higher glass transition temperature, tensile strength, and lower coefficient of thermal expansion, dielectric constant and loss, etc. Therefore, the epoxy resin cured product based on the novel non-coplanar diamine has been shown in electronic packages Potential applications in the field.