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金线在LED封装中作为导线将芯片表面电极与支架连接起来。通常我们测量金线拉力的位置为弧线上弯曲处,实际测量中大多是金线和芯片电极结合点断,很少出现引脚点断。根据受力分析,测量金线拉力时,金线和芯片电极结合点受到的拉力远大于引脚点,当两点抗拉性相同时,肯定是金线和芯片电极结合点断。因此我们现在测量金线拉力的位置不合理。根据理论分析和实际测量数据,测拉力位置应改在弧长中点。
Gold wire in the LED package as a wire to the chip surface electrode and bracket connected. Usually we measure the location of the pull line of the arc bending on the curve, the actual measurement is mostly the combination of gold wire and chip electrode off, there is very little lead off. According to the force analysis, when measuring the pulling force of gold wire, the pulling force of gold wire and the chip electrode bonding point is far greater than the lead point. When the two points have the same tensile resistance, the connection between the gold wire and the chip electrode is definitely broken. Therefore, we now measure the location of gold wire pull unreasonable. According to the theoretical analysis and the actual measurement data, the measured tensile force should be changed at the midpoint of the arc length.